放大
本材料是支持高频信号等的大容量以及高速传送的多层基板材料。
其具有低介电率、低介电损耗角正切，以及高耐热性和高可靠性。
Circuit Board Materials
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8S, MEGTRON8 R-579YS(U), R-579YS(N) / R-5795S(U), R-5795S(N) R-579Y(U), R-579Y(N) / R-5795(U), R-5795(N)
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON7 R-578Y(N), R-578Y(GN), R-578Y(GE), R-578Y(R) / R-5785(N), R-5785(GN), R-5785(GE), R-5785(R)
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON6 R-5775(N),R-5775(K),R-5775(G),R-5775(S),R-5775(R)
- Low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON4S, MEGTRON4 R-5725S, R-5725
- Low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON M R-5735
- Halogen-free low transmission loss, highly heat-resistant multi-layer circuit board materials Halogen-free MEGTRON2 R-1577
- There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
Video
Transmission loss performance Ranking in MEGTRON series
Line-up(Frequency dependence by transmission loss)
General properties
| Item | Glass transition temp. (Tg) | CTE z-axis | T288 (with copper) | Dielectric constant (Dk) | Dissipation factor (Df) | Peel strength | ||
| α1 | α2 | @12-14GHz | 1oz (35μm) | |||||
| Test method | DSC | IPC-TM-650 2.4.24 | IPC-TM-650 2.4.24.1 | Balanced-type circular disk resonator method | IPC-TM-650 2.4.8 | |||
| Condition | A | A | A | C-24/23/50 | A | |||
| Unit | °C | ppm/°C | min | － | kN/m | |||
| MEGTRON8S | R-579YS(U) R-5795S(U) | 220*¹ | 35 | 240 | >120 | 3.19 [@14GHz] | 0.0012 [@14GHz] | 0.7 (Cu: H-VLP3) |
| R-579YS(N) R-5795S(N) | 220*¹ | 35 | 240 | >120 | 3.22 [@14GHz] | 0.0015 [@14GHz] | 0.7 (Cu: H-VLP3) | |
| MEGTRON8 | R-579Y(U) R-5795(U) | 220*¹ | 50 | 270 | >120 | 3.08 [@14GHz] | 0.0012 [@14GHz] | 0.7 (Cu: H-VLP3) |
| R-579Y(N) R-5795(N) | 220*¹ | 50 | 270 | >120 | 3.13 [@14GHz] | 0.0016 [@14GHz] | 0.7 (Cu: H-VLP3) | |
| MEGTRON7 | R-578Y(N) R-5785(N) | 200 | 42 | 280 | >120 | 3.31 [@14GHz] | 0.0023 [@14GHz] | 0.8 (Cu: H-VLP) |
| R-578Y(GN) R-5785(GN) | 200 | 42 | 280 | >120 | 3.31 [@14GHz] | 0.0023 [@14GHz] | 0.8 (Cu: H-VLP2) | |
| R-578Y(GE) R-5785(GE) | 200 | 42 | 280 | >120 | 3.60 [@13GHz] | 0.0034 [@13GHz] | 0.8 (Cu: H-VLP2) | |
| R-578Y(R) R-5785(R) | 200 | 42 | 280 | >120 | 3.31 [@14GHz] | 0.0023 [@14GHz] | 0.8*² (Cu: Buried Resistor) | |
| MEGTRON6 | R-5775(N) | 185 | 45 | 260 | >120 | 3.34 [@13GHz] | 0.0037 [@13GHz] | 0.8 (Cu: H-VLP) |
| R-5775(K) R-5775(G) | 185 | 45 | 260 | >120 | 3.62 [@13GHz] | 0.0046 [@13GHz] | 0.8 (Cu: H-VLP) | |
| R-5775(S) | 185 | 45 | 260 | >120 | 3.34 [@13GHz] | 0.0037 [@13GHz] | 0.8*² (Cu: Buried Resistor) | |
| R-5775(R) | 185 | 45 | 260 | >120 | 3.62 [@13GHz] | 0.0046 [@13GHz] | 0.8*² (Cu: Buried Resistor) | |
| MEGTRON4 | R-5725 | 176 | 35 | 265 | 30 | 3.68 [@13GHz] | 0.0074 [@13GHz] | 1.2 (Cu: ST) |
| MEGTRON4S | R-5725S | 200 | 32 | 250 | 50 | 3.8 [@10GHz]*³ | 0.007 [@10GHz]*³ | 1.4 (Cu: ST) |
| MEGTRON M | R-5735 | 195 | 31 | 240 | 35 | 3.75 [@13GHz] | 0.0087 [@13GHz] | 1.3 (Cu: ST) |
| Halogen-free MEGTRON2 | R-1577 | 170 | 34 | 200 | 25 | 4.0 [@10GHz]*³ | 0.013 [@10GHz]*³ | 1.3 (Cu: ST) |
The sample thickness of MEGTRON8, MEGTRON7, MEGTRON6 and Halogen-free MEGTRON6 is 0.75mm. The sample thickness of other part number is 0.8mm.
*1 Test method: DMA
*2 Buried Resistor Copper Foil 1/2oz (18μm)
*3 [@10GHz] Test method: IPC-TM-650 2.5.5.5
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
